LOCTITE 3874 is a thermally conductive adhesive. When used
with Activator 7387, it cures rapidly to form a high
strength, high modulus, thermoset acrylic polymer. Typical
applications include bonding heat sinks to heat dissipating
components such as BGAs in electronics applications. The
thixotropic nature of LOCTITE 3874 Adhesive reduces the migration of
liquid product after application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.08
Flash Point - See SDS
Viscosity, Brookfield - HBT, 25 °C, mPa·s (cP):
Spindle TB, speed 0.5 rpm, Helipath 800,000 to 1,800,000LMS
Spindle TB, speed 5 rpm, Helipath 200,000 to 450,000LM
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 24 hours @ 70 °C, followed by 7 days @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K) 1.25
Glass Transition Temperature, °C 49
Shore Hardness, ISO 868, Durometer D 72
Elongation, at break, ISO 37, % 3.2
