BERGQUIST HI-FLOW THF 3000UT Features and Benefits
• Thermal impedance: 0.05°C-in.2/W
(at 25 psi)
• High thermal conductivity: 3.0 W/mk
• Phase change softening temperature
52°C
• Naturally tacky
• Tabulated for ease of assembly
BERGQUIST HI-FLOW THF 3000UT is a naturally tacky, thermally conductive phase change
material which is supplied in an easy to use tabulated pad form. In the application the material
undergoes a phase change softening, starting near 52°C. The phase change softening feature
improves handling characteristics prior to a facilitated assembly. At application temperatures and
pressures, BERGQUIST HI-FLOW 565UT wets out the thermal interfaces producing a very
low thermal impedance.
BERGQUIST HI-FLOW 565UT Typical Applications Include:
• Processor lid to heat sink
• Processor die to lid or heat sink
• FBDIMM to heat spreader
Configurations Available:
• Tabulated in roll form, kiss-cut parts – no holes
• BERGQUIST HF565UT is limited to a square or rectangular part design.
Dimensional tolerance is +/- 0.020 in. (0.5 mm)
