1.Thermal conductivity: 12 W/m-K (ASTM D5470)
2.Exceptional thermal performance at low pressures
3.Ultra-low modulus allows for excellent adhesion to rough surfaces
4.Supplied with protective liners for ease of use
5.High-compliance
BERGQUIST GAP PAD TGP 12000ULM is an extremely soft gap filling material rated at a high thermal conductivity of 12.0 W/m-K.
It is specially formulated for high performance applications requiring low assembly stress.
The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.
BERGQUIST GAP PAD TGP 12000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface.
Protective liners are supplied on both sides allowing for ease of use. The material is available in either gray or red color to meet customer requirements.
TYPICAL APPLICATIONS
1.Telecommunications (routers, switches, base stations)
2. Optical transceivers
3. ASICs and DSPs
TYPICAL PROPERTIES OF CURED MATERIAL
Color Grey
Physical Properties Hardness, Shore 000, ASTM D2240 68
Inherent Surface Tack 2
Density, ASTM D792, g/cc 3.1
Heat Capacity, ASTM E1269, J/g-K 0.7
Shelf life, days 180
Young's Modulus kPa 103
(psi) (15)
Electrical Properties
Volume Resistivity, ASTM D257, ohm-meter 1.5×1012
Dielectric Constant, ASTM D150, 1,000Hz 8.4
Dielectric Breakdown Voltage:
0.04 inch sample, VAC 6,200
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 12
Material solutions for cloud recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for cloud datacenter recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for hyperscale datacenter recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for switches recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for routers recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for servers recommends BERGQUIST GAP PAD TGP 12000ULM
