BERGQUIST GF3500S35,GAP FILLER 3500S35,GAP FILLER TGF 3600
Thermal paste of BERGQUIST GAP FILLER TGF 3600 is a two-component, liquid gap-filling material,
cured at either room or elevated temperature, featuring ultra-high thermal
performance and outstanding softness.Prior to curing, the material maintains
good thixotropic characteristics as well as low viscosity. The result is a gel-like
liquid material designed to fill air gaps and voids yet flow when acted upon by
an external force (e.g., dispensing or assembly process). The material is an
excellent solution for interfacing fragile components with high topography and/
or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a
low modulus elastomer designed to assist in relieving CTE stresses during thermal
cycling yet maintain enough modulus to prevent pump-out from the interface.
BERGQUIST GAP FILLER TGF 3600 will lightly adhere to surfaces, thus improving
surface area contact. Thermal paste of BERGQUIST GAP FILLER 3500S35 is not designed to be a
structural adhesive.
BERGQUIST GF3500S35 Typical Applications Include:
• Automotive electronics
• Discrete components to housing
• PCBA to housing
• Fiber optic telecommunications equipment
Configurations Available:
• Supplied in cartridge or kit form
