BERGQUIST BP108 BOND-PLY 100 BOND-PLY TBP 850
BERGQUIST BOND-PLY 100 Configurations Available:
• Sheet form, roll form and die-cut parts
Shelf Life: The double-sided, pressure sensitive adhesive used in BOND-PLY products
requires the use of dual liners to protect the surfaces from contaminants. Henkel
recommends a 6-month shelf life at a maximum continuous storage temperature of
35°C or 3-month shelf life at a maximum continuous storage temperature of 45°C, for
maintenance of controlled adhesion to the liner. The shelf life of the BOND-PLY material,
without consideration of liner adhesion (which is often not critical for manual assembly
processing), is recommended at 12 months from date of manufacture at a maximum
continuous storage temperature of 60°C.
BERGQUIST BP100 Typical Applications Include:
• Mount heat sink onto BGA graphic
processor or drive processor
• Mount heat spreader onto power
converter PCB or onto motor control PCB
