Laird Gap Fillers Series
Laird Thermal Interface Materials Gap Fillers Series
1.What are Gap Fillers?
Thermal gap fillers are valuable aids as electronic component heat dissipation materials because
of their thermal conductivity properties. They fill spaces and replace the air from them.
Air is a poor conductor of heat. Aided by their thermal conductivity properties, gap fillers are scientifically
engineered to increase overall heat transfer inside a device or system.
They keep components cooler and within allowable thermal ranges.
A gap filler is a class of thermal interface materials that fills “a large gap” between heat generating
and heat dissipating surfaces. Often, one gap filler can cover multiple heat sources within an application.
The material can be placed across three different heat sources with varying heights. A gap filler material is
expected to be compliant without generating too much pressure within the system. Gap fillers are usually
silicone based because silicone has many attractive properties such as surface wetting, high thermal stability,
and physical inertness. Newer offerings can contain no silicone. The silicone is normally used as the binder
within a gap filler system. The silicone matrix is then filled with thermally conductive fillers - BN, ZnO, and alumina.
These fillers make up the functional portion of the gap filler which gives it its thermal properties.
Standard thicknesses of gap fillers tend to be 0.25-5mm (10-200 mils). They feature deflection without excessive pressure.
Gap fillers need to be relatively compliant to achieve high deflections without generating excess pressure within an application.
The optimal properties of gap filler materials include low total thermal resistance, high thermal conductivity,
and low contact resistance (good surface wetting). They should be easy to handle.
There is a need for low outgassing/low bleeding.
Excessive outgassing can cause silicone to condense and build up on optical applications.
2.Laird Gap Fillers Series include
Laird Slim Tim 10000
Laird Tflex 300
Laird Tflex 300TG
Laird Tflex 50000
Laird Tflex 600
Laird Tflex 700
Laird Tflex B200
Laird Tflex HD300
Laird Tflex HD300TG
Laird Tflex HD700
Laird Tflex HD80000
Laird Tflex HD90000
Laird Tflex HP34
Laird Tflex HR400
Laird Tflex HR600
Laird Tflex P100
Laird Tflex P300
Laird Tflex RB300
Laird Tflex SF10
Laird Tflex SF600
Laird Tflex SF800
Laird Tgon 800
Laird Tpli 200
Laird Tputty 502
1.What are Gap Fillers?
Thermal gap fillers are valuable aids as electronic component heat dissipation materials because
of their thermal conductivity properties. They fill spaces and replace the air from them.
Air is a poor conductor of heat. Aided by their thermal conductivity properties, gap fillers are scientifically
engineered to increase overall heat transfer inside a device or system.
They keep components cooler and within allowable thermal ranges.
A gap filler is a class of thermal interface materials that fills “a large gap” between heat generating
and heat dissipating surfaces. Often, one gap filler can cover multiple heat sources within an application.
The material can be placed across three different heat sources with varying heights. A gap filler material is
expected to be compliant without generating too much pressure within the system. Gap fillers are usually
silicone based because silicone has many attractive properties such as surface wetting, high thermal stability,
and physical inertness. Newer offerings can contain no silicone. The silicone is normally used as the binder
within a gap filler system. The silicone matrix is then filled with thermally conductive fillers - BN, ZnO, and alumina.
These fillers make up the functional portion of the gap filler which gives it its thermal properties.
Standard thicknesses of gap fillers tend to be 0.25-5mm (10-200 mils). They feature deflection without excessive pressure.
Gap fillers need to be relatively compliant to achieve high deflections without generating excess pressure within an application.
The optimal properties of gap filler materials include low total thermal resistance, high thermal conductivity,
and low contact resistance (good surface wetting). They should be easy to handle.
There is a need for low outgassing/low bleeding.
Excessive outgassing can cause silicone to condense and build up on optical applications.
2.Laird Gap Fillers Series include
Laird Slim Tim 10000
Laird Tflex 300
Laird Tflex 300TG
Laird Tflex 50000
Laird Tflex 600
Laird Tflex 700
Laird Tflex B200
Laird Tflex HD300
Laird Tflex HD300TG
Laird Tflex HD700
Laird Tflex HD80000
Laird Tflex HD90000
Laird Tflex HP34
Laird Tflex HR400
Laird Tflex HR600
Laird Tflex P100
Laird Tflex P300
Laird Tflex RB300
Laird Tflex SF10
Laird Tflex SF600
Laird Tflex SF800
Laird Tgon 800
Laird Tpli 200
Laird Tputty 502
